Skip to main content

Micron’s 3D XPoint-based QuantX memory devices may not arrive until late 2017

Introducing 3D XPoint™ Technology
Intel’s Optane products that rely on 3D XPoint non-volatile memory technology, which was co-developed with Micron, finally made their debut at CES 2017 in January. However, they won’t be the only memory solutions in 2017 to rely on this new technology, as Micron plans to release products of its own under the QuantX brand that will focus on high-end systems and servers.

Scott DeBoer, vice president of Micron, made this revelation during an analyst meeting in Scottsdale, Arizona, indicating that 3D XPoint technology aims to increase storage capacity while reducing data latency and end-user cost though DIMM modules and solid-state drives. But those products will not be made available for a while, giving Intel a big leap ahead of Micron in regard to market saturation with 3D XPoint-based products.

Recommended Videos

That is because Micron indicated in a recent earnings call that the company would see very little revenue from products based on this technology in fiscal 2017. Instead, Micron expects to see five percent of its revenue in fiscal 2018 stemming from its currently unannounced 3D XPoint-based QuantX devices.

Please enable Javascript to view this content

During CES 2017, Intel revealed two Optane stick-shaped SSDs that slip into M.2 slots on motherboards. The modules only had 16GB and 32GB capacities, meaning they would be used to provide SSD-like performance in systems that still rely on clunky hard drives. These sticks can also be mounted on a special PCI Express card that is installed in a system like a graphics card.

A system with an installed Optane storage device becomes faster because the most-used files are stored in the 3D XPoint memory while all the other data resides on the hard drive. The big deal with 3D XPoint memory is that it is supposedly 1,000 times faster than NAND flash technology and 1,000 times more reliable too. Even more, 3D XPoint is around half the cost of DRAM.

3D XPoint technology is different than standard NAND flash technology in that it stacks memory cells vertically instead of horizontally. It doesn’t rely on transistors but instead consists of a “three-dimensional checkerboard” featuring memory cells that sit at the intersection of rows (word lines) and columns (bit lines). This enables memory cells to be accessed directly, which contain small amounts of data that can be quickly read and written.

“Perpendicular conductors connect 128 billion densely packed memory cells,” Micron states. “Each memory cell stores a single bit of data. This compact structure results in high performance and high density.”

In a nutshell, Intel and Micron have created memory technology that is fast like system memory (DRAM), has the storage capability of SSDs (non-volatile), and is highly inexpensive. It is a marriage of two memory classes that provides 10 times more storage density than traditional DRAM. It also eliminates the data flow bottleneck created within the CPU/DRAM/storage pathway, speeding up the system.

Micron will likely talk more about its QuantX products later in 2017 during Computex and/or CeBIT.

Kevin Parrish
Former Digital Trends Contributor
Kevin started taking PCs apart in the 90s when Quake was on the way and his PC lacked the required components. Since then…
AMD’s Ryzen 7 9800X3D might show up sooner than expected
AMD CEO holding 3D V-Cache CPU.

AMD might be moving on 3D V-Cache versions of its Ryzen 9000 CPUs faster than expected. According to a leaker on the Chiphell forums, the Ryzen 7 9800X3D, which could be among the best processors when it releases, might arrive as soon as next month.

VideoCardz dug up the news, which started on the Chiphell forums. The leaker goes by the name zhangzhonhao, but VideoCardz notes that they went under a different alias previously, and that they have a long history of leaking company road maps. The forum post claims AMD will release the Ryzen 7 9800X3D at the end of October, while the Ryzen 9 9900X3D and Ryzen 9 9950X3D will arrive later. The leaker suspects they'll show up in early 2025 with "some new features."

Read more
AMD’s new CPU could silently replace the Ryzen 7 7800X3D
The AMD Ryzen 5 7600X3D CPU.

AMD just expanded its lineup of gaming CPUs, but it's not a Zen 5 chip. Instead, AMD launched a new Zen 4 CPU, the Ryzen 5 7600X3D. Once again a Micro Center exclusive, the CPU could be an interesting budget offering ... if not for the fact that it still costs a pretty penny. Meanwhile, the Ryzen 7 7800X3D seems to be disappearing from the market. What's going on?

The fact that AMD revisited the Zen 4 lineup is not surprising, as it still continues to release Zen 3 chips. It's also not shocking that the Ryzen 5 7600X3D is a Micro Center exclusive, as the Ryzen 5 5600X3D was also only available at that one retailer. In the case of the 7600X3D, though, it'll also be available in Germany through Mindfactory.

Read more
AMD on the Ryzen 7 9800X3D: ‘We have a lot to say’
A delidded Ryzen 7000 CPU.

AMD just revealed its Ryzen 9000 chips at Computex 2024, but the company is already working on its versions of these processors with 3D V-Cache. These X3D variants, as they're called, have been a mainstay of AMD's lineup since the Ryzen 7 5800X3D, and they consistently rank among the best gaming processors. AMD's Donny Woligroski says the company is "not just resting on laurels," and that it has some big plans for the next version of X3D chips.

The news comes from PC Gamer, which shared various quotes from an interview with Woligroski. Although we've known for a while that 3D V-Cache would come to Ryzen 9000 eventually, Woligroski says that AMD is pushing the tech forward. "It's not like, 'hey, we've also added X3D to a chip.' We are working actively on really cool differentiators to make it even better. We're working on X3D, we're improving it," Woligroski told PC Gamer.

Read more